Developing Diffusion Bonding Windows for Joining Z31 Magnesium and Copper using Nickel Interlayer

Author(s): P. Sivakumar, T. Senthilkumar, M. Pavithran

Abstract: In this investigation  AZ-31and Cu dissimilar materials are joined by diffusion bonding process the principal difficulty when joining AZ-31 and Cu lies on the existence of hard to remove oxide films in magnesium surface sand the formation of brittle metallic interlayer sand    oxide inclusions in the bond region. Conventional fusion welding is not a feasible  technique  to join these kinds of dissimilar  joints due to the formation  of chemical mechanical and structural heterogeneities. Solid state joining is  a suitable alternate to overcome the difficulties. Diffusion bonding gives a sound bond without any  macroscopic deformation because it involves only inter-atomic diffusion of atoms across the interface between the two metals being bonded. Energy required for the movement of atoms depends on the applied pressure and temperature. One important advantage of the diffusion bonding is that the individual characteristic so the base materials are retained after bonding, except probably at the interface. The main purpose of the present study is to investigate and compare the characteristicsofdissimilarjoiningofAZ-31magnesium with commercial grade copper alloys using diffusion bonding process. AZ-31 with Cu were carried out by varying the bonding temperature from 400°C to480ºC in the bonding pressure of 12MPa, stress from 66to81MPa and time from 30 to80 minutes.